October 27–29, 2026
Vibe Credit Union Showplace, Novi, Michigan, USA

Exhibitor Products

24 Jul 2026

EMProbe-DBM-E6 — 6-Axis Robotic Near-Field EMI Diagnostics on the Bench

Absolute EMC Hall: TXNA Stand: T1028

EMProbe-DBM-E6 — 6-Axis Robotic Near-Field EMI Diagnostics on the Bench

Accurate, repeatable EMI source localization using a single probe and a 6-axis robotic arm

Handheld near-field probing is a proven method for diagnosing EMC/EMI issues, but it is inherently operator-dependent and difficult to reproduce—especially on dense boards, assemblies with height variation, or complete products. The EMProbe-DBM-E6 solves this by combining a computer-controlled 6-axis robotic arm with near-field probes and EMViewer software to deliver high-precision, repeatable scanning with 0.01 mm repeatability.

This platform is ideal for pre- and post-compliance diagnostics, including scanning of non-flat surfaces and complete products, where traditional planar scanning methods are limited. System performance is primarily determined by the selected spectrum analyzer and probe, enabling a scalable solution aligned to your measurement needs. 


Key Technical Advantages

  • Robotic repeatability (0.01 mm) to remove operator variability and improve correlation between design iterations 
  • 6-axis motion enables scanning over 3D geometries, tall components, and non-flat DUT surfaces 
  • Probe-agnostic workflow supports off-the-shelf handheld probes and Y.I.C. probes 
  • Spectrum analyzer flexibility: analyzers supporting SCPI can be controlled from EMViewer 
  • Fast debug cycle: diagnose, modify, and retest quickly—supports intermittent issues and verification of fixes 
  • Broad application coverage: emissions, immunity, filtering, shielding, broadband noise, and common-mode checks 

Typical Applications

  • Component-side scanning of dense PCBs (high-speed / high-power / high-density) 
  • EMProbe-DBM-E6-Datasheet
  • 3D near-field scanning of assemblies and complete products
  • Root-cause localization for radiated emissions and coupling paths
  • Cable/common-mode noise investigations (with suitable probes)
  • EMI shielding effectiveness checks (relative comparisons)
  • Design iteration comparisons and documented debug workflows
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