Attendees will leave with a clear, non-technical understanding of what's actually driving AI hardware cost, availability and performance limits, chiplet design, advanced packaging and process-node constraints, so they can have more informed, credible conversations with customers evaluating AI infrastructure investments.

• How chiplet-based chip design tests known-good-die validation before assembly, a cross-industry QA parallel
• Why die-to-die interconnect and packaging choices create new failure modes requiring rethought test strategies
• How semiconductor design-for-test (DFT) principles could translate to complex multicomponent vehicle system testing
• A cross-industry view: lessons from AI chip validation at massive scale (100B+ transistors) applied elsewhere
• Where semiconductor and automotive testing challenges converge, and where they meaningfully diverge